Title:
圧電デバイス
Document Type and Number:
Japanese Patent JP5218543
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a surface-mount piezoelectric device (oscillator, filter) which solves the deterioration of various characteristics attributed to the occurence of thermal stress even when a piezoelectric vibration element is connected to an inner bottom surface of a ceramic package with a solid conductive adhesive.SOLUTION: In the piezoelectric device, a piezoelectric vibration element is electrically and mechanically connected to be open-sided and held in a surface-mounted package. Each of pad electrodes on one surface of the piezoelectric vibration element is connected to a corresponding conductive pad on an inner bottom surface of the surface-mount package with a solid conductive adhesive. The piezoelectric device is configured such that the main vibration part of the piezoelectric vibration element is positioned on an extended line connecting the spots of the conductive adhesive applied on the pad electrodes.
Inventors:
Ryoichi Yasuike
Application Number:
JP2010282885A
Publication Date:
June 26, 2013
Filing Date:
December 20, 2010
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H03H9/10; H01L41/09; H01L41/18; H01L41/22; H01L41/313; H03H9/02; H03H9/19; H03H9/56
Domestic Patent References:
| JP3151707A | ||||
| JP11136074A | ||||
| JP10284975A | ||||
| JP4061413A | ||||
| JP9326667A | ||||
| JP2001085966A | ||||
| JP2000332571A | ||||
| JP2000332572A | ||||
| JP2000114911A | ||||
| JP2000278080A |
Attorney, Agent or Firm:
Hitoshi Suzuki