PURPOSE: To make easy small size package, by providing the part consisting of the conductive material electrically isolated with the electrode of oscillator chip at a part of the oscillator package, and by grounding the part consisting of the conductive material.

CONSTITUTION: At a part of the oscillator package, the metalized layer 4 consisting of the conductive material electrically isolated from the electrodes 2a and 2b of the oscillator chip is provided, and the metalized layer 4 is grounded, making easy for small size of the package. That is, the capacitances Cam and Cbm between the electrodes 2a, 2b and the matalized layer 4 are in parallel with the capacitances Co and Ci. If the capacitances Co and Ci are made smaller by Cam and Cbm, it is the same as the oscillator not having Cam and Cbm, and if Cam and Cbm are greater to an extent, either or both of the external capacitances Co and Ci can be omitted, and the number of components can be reduced.