ピンの研磨方法、及び回路基板の製造方法

Title:

ピンの研磨方法、及び回路基板の製造方法

Document Type and Number:

Japanese Patent JP6867277

Kind Code:

B2

Abstract:

To provide a pin polishing method by which a pin can be stably polished in a punch die to/from which a pin can be attached/detached.SOLUTION: A pin polishing method in a punch die. The punch die comprises a lower die, plural pins, and an upper die. The lower die has a loading surface on which a sheet-like work-piece is loaded. The plural pins respectively have a first end face for punching the work-piece. The upper die holds the plural pins in a detachable state. This pin polishing method comprises: a process in which an elastic body is located between a second end face on a side opposite to the first end face and the upper die for each of the plural pins so as to contact the second end face and the upper die; and a process in which the end faces of the plural pins are polished in the state that the elastic body is located.SELECTED DRAWING: Figure 1

Inventors:

Yasuharu Yamada
Atsushi Suzuki
Exit Western line

Application Number:

JP2017240423A

Publication Date:

April 28, 2021

Filing Date:

December 15, 2017

Export Citation:

Click for automatic bibliography generation Help