Title:
パイプ接合装置及びパイプ接合装置組立体
Document Type and Number:
Japanese Patent JP7460987
Kind Code:
B2
Abstract:
To provide a pipe joining device and a pipe joining device assembly that are simply configured but can join a plurality of pipes to each other.SOLUTION: A pipe joining device 100 includes: projection parts 10 mounted on an inner side of a pipe 50 and fitted to through-holes 52a, 52b of the pipe 50; abutment parts 30 abutting on an inner surface 51 of the pipe 50; and a support part 20 extending in an arch-shape toward the abutment parts 30 from base end parts 11 of the projection parts 10.SELECTED DRAWING: Figure 5
Inventors:
Yosuke Okamura
Yosuke Takeuchi
Hisami Kasahara
Toru Oguma
Ikuya Tsuruta
Isao Baba
Tetsuya Ogawa
Yosuke Takeuchi
Hisami Kasahara
Toru Oguma
Ikuya Tsuruta
Isao Baba
Tetsuya Ogawa
Application Number:
JP2020179316A
Publication Date:
April 03, 2024
Filing Date:
October 27, 2020
Export Citation:
Assignee:
Nippon Telegraph and Telephone Corporation
To Two Soken Co., Ltd.
To Two Soken Co., Ltd.
International Classes:
F16B7/10; F16L25/08; H02G9/10
Domestic Patent References:
JP57012960U | ||||
JP53041668Y1 | ||||
JP61019116U | ||||
JP2006112577A | ||||
JP59090609U | ||||
JP2000328779A | ||||
JP47029395U |
Attorney, Agent or Firm:
Kenji Sugimura
Yamato Okano
Shingo Kitamura
Yamato Okano
Shingo Kitamura