PURPOSE: To reduce the warpage by the tensile stress working at all times against the expansion and contraction of a conductive metal and an insulated layer generating when a heat treatment is conducted, and to contrive improvement both in warpage strength and mechanical strength of the title planar coil by a method wherein the thin type planar coil is formed into laminated structure by arranging at least a conductor, an insulated layer containing a core material, and a conductor in the above- mentioned order.
CONSTITUTION: A thin type planar coil is formed in laminated structure by arranging a conductor 2, a semiinsulated layer 4 on which a glass fiber cloth is arranged in the center as a core wire 3, and a conductor 2 in the above-mentioned order. The insulated layer 4 of the above-mentioned structure is formed with single epoxy resin, and an overcoating layer 5, consisting of insulating varnish solder resist and the like of insulative resin for insulation and prevention of surface oxidation, is formed on the outside of a resist 1. Also, the surface to be adhered with insulative resin 4a of the conductor 2 is coated with the insulated layer 4, said insulated layer 4 is adhered to both ends of the glass fiber-woven cloth using the resin 4a, and then they are covered with the layer 5. The warpage of the coil itself can be made small by the tensile stress working at all times against the expansion and contraction of the conductive metal and the insulated layer generated when a heat treatment is conducted.
HASHIMOTO TETSUYA
KOYAMA RYOHEI
| JPS58197710A | 1983-11-17 | |||
| JPS63144755A | 1988-06-16 | |||
| JPS572628U | 1982-01-08 |