Title:
PLANING-POLISHING APPARATUS AND METHOD USING FEMTOSECOND PULSED LASER
Document Type and Number:
Japanese Patent JP2022119165
Kind Code:
A
Abstract:
To provide an apparatus for performing planing a large-area planar workpiece by using a femtosecond pulsed laser, and then performing polishing for reducing the surface roughness.SOLUTION: A planing-polishing apparatus using a femtosecond pulsed laser is provided, comprising: a stage 110 on which a workpiece is seated; a fixing jig 120 for fixing the workpiece on the stage 110; a position fixing unit comprising transport means 130 for moving the stage 110 along X and Y axes; a surface shape measurement unit digitalizing a surface shape of the workpiece and transmitting the surface shape data; a laser machining unit 300 performing a planing process of planarizing a machining area by selectively irradiating the machining area with a femtosecond pulsed laser in accordance with the surface shape data (ZD) and performing polishing for further reducing irregularities by irradiating the irregularities with another femtosecond pulsed laser having a predetermined power level; and a controller 400 controlling an operation of the laser machining unit 300.SELECTED DRAWING: Figure 6
Inventors:
KIM SUNG HWAN
KANG HYOUNG SHIK
YOU DONG BIN
KANG HYOUNG SHIK
YOU DONG BIN
Application Number:
JP2021125056A
Publication Date:
August 16, 2022
Filing Date:
July 30, 2021
Export Citation:
Assignee:
21TH CENTURY CO LTD
International Classes:
B23K26/356
Domestic Patent References:
| JP2020514067A | 2020-05-21 | |||
| JP2008119718A | 2008-05-29 | |||
| JP2019506298A | 2019-03-07 | |||
| JP2020059030A | 2020-04-16 |
Foreign References:
| WO2021039881A1 | 2021-03-04 |
Attorney, Agent or Firm:
Shin Shin