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Title:
PLANT GERMINATION-SUPPRESSIVE SAND, PLANT GERMINATION-SUPPRESSIVE MATERIAL, ITS PRODUCTION, AND APPLICATION FOR SUPPRESSING WEED GERMINATION
Document Type and Number:
Japanese Patent JPH08119815
Kind Code:
A
Abstract:

PURPOSE: To obtain plant (esp. weed) germination-suppressive sand causing no runoff thereof to soil and usable in various sites, by coating sand with alumina or silica film containing metal(s) or compound(s) thereof having plant germination-suppressive action.

CONSTITUTION: This plant germination-suppressive material, esp. plant germination-suppressive sand, is obtained by coating the surface of an inorganic base material such as sand with alumina or silica film containing metal(s) or compound(s) thereof having plant germination-suppressive action. Instead of sand, glass particles or silica gel granules may also be used. The metal(s) having plant germination-suppressive action is e.g. silver, copper, zinc, tin, compound(s) thereof being preferable. This material (esp. sand) is put into a site freed from the soil or sand of the aimed place over a depth of 2cm or more to enable the germination of the weeds at the site to be suppressed. In particular, it is recommended that this material (sand) be applied around gravestones.


Inventors:
ICHIKAWA KENJI
Application Number:
JP28743494A
Publication Date:
May 14, 1996
Filing Date:
October 26, 1994
Export Citation:
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Assignee:
NIKKO KK
International Classes:
B01J2/00; A01N25/26; A01N25/34; A01N59/16; A01N59/20; (IPC1-7): A01N59/20; A01N25/26; A01N25/34; A01N59/16; B01J2/00
Attorney, Agent or Firm:
Shoichi Mukaiyama (1 person outside)