Title:
PLASMA CLEANING DEVICE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3218846
Kind Code:
B2
Abstract:
PURPOSE: To clean a wire bonding pad by placing a board that is mounted with a chip and a die that exposes a wire bonding on one of a pair of counter electrodes, grounding it and connecting the other with a high frequency power supply, and arranging a measure to limit an area to generate a plasma corresponding to the layout of components on the board.
CONSTITUTION: A first electrode 6 and a second electrode 8 facing each other are arranged in a vacuum chamber 1. A board 9, mounted with a soldered chip 10 and a die 17 on the surface of which wire bonding pads are exposed, is placed on either of the first electrode 6 and the second electrode 8. Then either of the first electrode 6 and the second electrode 8 is electrically grounded and the other is connected with a high frequency power supply 7. A shield 21 to limit the area to generate the plasma corresponding to the layout of components on the board 9 is arranged on at least one of the first electrode 6 and the second electrode 8. The plasma is irradiated to the limited area around the die on the board corresponding to the layout of components on the board.
Inventors:
Mitsuru Ohzono
Application Number:
JP6837694A
Publication Date:
October 15, 2001
Filing Date:
April 06, 1994
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/302; H01L21/304; H01L21/3065; H01L21/60; (IPC1-7): H01L21/3065; H01L21/304; H01L21/60
Domestic Patent References:
| JP5235520A | ||||
| JP58110674A | ||||
| JP59100900A | ||||
| JP63181440A | ||||
| JP547709A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)