PURPOSE: To rapidly and easily form a film having a uniform thickness on a substrate by inclining the front surface of the substrate with plasma flow and rotating the substrate in such a manner that the intersected point of the central axis of the substrate and the central axis of the plasma flow exists on the substrate.
CONSTITUTION: An annular target 18 in the inlet of a film forming chamber 3 is sputtered by plasma 16 formed in a plasma forming chamber 1 and the particles of a material for film formation are splashed in the plasma flow 17 to form a film 29 on the substrate 21 on a substrate imposing base 22. The substrate 21 is rotated around the central axis 25 by a means 31 in such a manner that the front surface of the substrate 21 exists on the surface inclined by a prescribed angle θ with the surface orthogonal with the central axis 26 of the plasma flow 17 and the intersected point P of the central axis 25 of the substrate 21 and the central axis 26 of the plasma flow 17 exists on the front surface of the substrate 21. The film having the uniform thickness is rapidly and easily formed on the substrate 21 in this way.
MATSUURA TAKETOSHI
MATSUO SEITARO
ONO TOSHIRO
FUKUZAWA TETSUO
AFUTEI KK
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