Title:
プラズマエッチング方法及びプラズマ処理装置
Document Type and Number:
Japanese Patent JP7061918
Kind Code:
B2
Abstract:
A plasma etching method performed by a plasma processing apparatus is provided. The plasma processing apparatus includes an edge ring which includes an inner edge ring provided in a vicinity of a substrate to be placed on a stage, a middle edge ring arranged outside the inner edge ring, the middle edge ring being configured to be moved vertically by an actuation mechanism, and an outer edge ring arranged outside the middle edge ring. The method includes: performing first etching based on a first process condition; performing second etching based on a second process condition different from the first process condition; and moving the middle edge ring by the actuation mechanism, the moving being performed after the first etching is performed and before the second etching is performed.
Inventors:
Kosuke Ogasawara
Shuhei Yoshiba
Takanori Banse
Shuhei Yoshiba
Takanori Banse
Application Number:
JP2018082443A
Publication Date:
May 02, 2022
Filing Date:
April 23, 2018
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065; H05H1/46
Domestic Patent References:
| JP2012222235A | ||||
| JP2009044075A | ||||
| JP7086252A | ||||
| JP7074155A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito