PLASMA-PROCESSING APPARATUS AND ITS METHOD

Japanese Patent JP3634734

B2

PROBLEM TO BE SOLVED: To provide a monitoring system for exactly capturing a state change of a plasma-processing apparatus.
SOLUTION: The plasma-processing apparatus includes a processing chamber 1 for processing samples. The plasma-processing apparatus is provided with a state-detecting means which detects a processing state inside of the chamber 1 and outputs a plurality of output signal and signal conversion portions 9a, 9b which produce an arbitrary number of apparatus-state signal composed of a arbitrary number of signal-processing filter taken out from a data base 10 collecting signals filters by a means for selecting a signal filter, and the signal conversion portions produce the apparatus-state signal having a time series of signal less than the output signal from the output signal.

JPH08114685	CT DIAGNOSIS DEVICE FOR NUCLEAR FUSION PLASMA
JP2004179669	PLASMA TREATMENT APPARATUS AND METHOD THEREFOR
JPS52100095	FUSION DEVICE

Junichi Tanaka
Hiroyuki Tachibana
Ryoji Nishio
Seiichiro Kanno
Hideyuki Yamamoto

JP2000289303A

March 30, 2005

September 22, 2000

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株式会社日立製作所

H05H1/00; B01J19/08; C23C16/52; C23F4/00; H01J37/32; H01L21/00; H01L21/302; H01L21/3065; H01L21/66; H05H1/46; (IPC1-7): H01L21/3065; C23C16/52; C23F4/00; H05H1/00; H05H1/46

JP6132251A
JP9283497A
JP2001521280A
JP10125660A
JP1187323A
JP200218274A

Barry M. Wise and Neal B Gallagher,Development and Benchmarking of Multivariate Statstical Process Control Tools for a Semiconductor Et,Supervison and Safety for Technical Processes,米国,Proc.IFAC Symp. on Fault Detection,1997年,1997 Vol.1,35-42

Katsuo Ogawa
Kyosuke Tanaka

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