Title:
PLASMA PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP3821065
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a plasma processing apparatus that can reduce a maintenance cost of an upper electrode cover.
SOLUTION: A plasma etch treatment apparatus is provided with an internal chamber on its upper part, and it is also provided with a plasma treatment vessel 2 made of electrically conductive material, an upper electrode 12 arranged on the upper part of the internal chamber, and an observation tube 100 mounted to the upper electrode 12. The upper electrode 12 is provided with an upper electrode body 32 made of metal such as Al or the like and an upper electrode cover 31 made of quartz that separates the upper electrode body 32 from a plasma area 41 formed within the internal chamber. The upper electrode cover 31 is provided with an inner flange on the bottom in a part corresponding to an open bush 32a of the upper electrode body 32 and a hole on the top that has an outer flange with a complementary shape to the inner flange, and a transparent window 31a is engaged with the hole.
Inventors:
Chikako Sekiya
Application Number:
JP2002195708A
Publication Date:
September 13, 2006
Filing Date:
July 04, 2002
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065; H05H1/46; H01J37/32; H01L21/306; (IPC1-7): H01L21/3065; H05H1/46
Domestic Patent References:
| JP2001313285A | ||||
| JP722387A |
Attorney, Agent or Firm:
Another role Shigehisa
Satoshi Muramatsu
Natsuki Goto
Hiroshi Ikeda
Hiroyasu Ninomiya
Satoshi Muramatsu
Natsuki Goto
Hiroshi Ikeda
Hiroyasu Ninomiya
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