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Title:
PLASMA TREATMENT APPARATUS, PLASMA TREATMENT METHOD
Document Type and Number:
Japanese Patent JP2022081984
Kind Code:
A
Abstract:
To provide a plasma treatment apparatus and a plasma treatment method, capable of imparting a high adhesion force between a component made of resin and a metal layer of a component surface and bonding these strongly.SOLUTION: A plasma treatment apparatus 1 includes: a holding table 4 configured to hold a substrate body 22 to be a target of plasma irradiation; a holding side circuit 13 configured to apply a holding side voltage to the held substrate body 22; a gas introduction part 15 configured to introduce a gas inside a vacuum chamber 2; and a plasma side circuit 14 having an FPG3 for making the gas into a plasma state and configured to apply a plasma side voltage to the FPG3. The time for the holding side circuit 13 to apply the holding side voltage to the substrate body 22 is set to be separated from the time for the plasma side circuit 14 to apply the plasma side voltage to the FPG3.SELECTED DRAWING: Figure 3

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Inventors:
KUBO HIROYOSHI
Application Number:
JP2020193259A
Publication Date:
June 01, 2022
Filing Date:
November 20, 2020
Export Citation:
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Assignee:
KOMIYAMA ELECTRON CO LTD
International Classes:
C08J7/00; H05H1/46
Attorney, Agent or Firm:
Hiroshi Sano
Akio Ishii



 
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