Title:
PLASMA SPUTTERING APPARATUS
Document Type and Number:
Japanese Patent JP2017088973
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a plasma sputtering apparatus capable of raising the efficiency of a plasma production and the movement of a sputter material at a plasma sputtering time.SOLUTION: A plasma sputtering apparatus comprises: a target material holding part for holding a target material; and a plasma producing part having a plasma producing surface. The plasma producing part is disposed such that the plasma forming face is positioned on the side of a target material surface held on the target material holding part, and the plasma forming face is so directed to the target material surface as to make an obtuse angle with respect to the target material surface. It is preferred that the plasma producing part has an angle of vertically + 20 degrees to vertically + 45 degrees with respect to the target forming face. As a result, the sputter efficiency is improved, and the movement of the sputter material becomes smooth so that the efficiency of deposition is improved at the time of deposition of the sputter material on a deposited material, and the heat damage on the deposited material during the sputtering is minimized to realize a low temperature process.SELECTED DRAWING: Figure 1
Inventors:
TAKEDA ETSUJI
KANAZAWA MASAHITO
MORITA SUSUMU
KANAZAWA MASAHITO
MORITA SUSUMU
Application Number:
JP2015222679A
Publication Date:
May 25, 2017
Filing Date:
November 13, 2015
Export Citation:
Assignee:
JAPAN STEEL WORKS LTD
International Classes:
C23C14/34; H05H1/46
Domestic Patent References:
| JP2011068918A | 2011-04-07 | |||
| JP2008088457A | 2008-04-17 |
Attorney, Agent or Firm:
Yuki Yokoi