Title:
PLASMA TREATMENT APPARATUS AND METHOD
Document Type and Number:
Japanese Patent JP3708031
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus and a plasma treatment method for suppressing influences due to disturbances.
SOLUTION: The plasma treatment apparatus has a plasma treatment apparatus 23 for performing treatment to a sample which is accommodated into a vacuum processing chamber, a sensor 24 for monitoring the amount of process that is being treated, a machining result estimation model 25 for estimating a machining result, based on monitor output from the sensor and the prediction expression of a preset machining result, and an optimum recipe calculation model 26 for calculating the compensation value of treatment conditions, based on the estimation result of the estimation model of the machining result, so that the machining result reaches a target value and controls the plasma treatment apparatus 23 based on recipes being generated by the optimum recipe calculation model.
Inventors:
Akira Kagoshima
Hideyuki Yamamoto
Kunihiko Ikuhara
Toshio Masuda
Hiroyuki Tachibana
Junichi Tanaka
Natsuyo Morioka
Kenji Tamaki
Hideyuki Yamamoto
Kunihiko Ikuhara
Toshio Masuda
Hiroyuki Tachibana
Junichi Tanaka
Natsuyo Morioka
Kenji Tamaki
Application Number:
JP2001198830A
Publication Date:
October 19, 2005
Filing Date:
June 29, 2001
Export Citation:
Assignee:
株式会社日立製作所
株式会社日立ハイテクノロジーズ
株式会社日立ハイテクノロジーズ
International Classes:
H05H1/00; B01J19/08; H01J37/32; H01L21/302; H01L21/3065; H01L21/66; (IPC1-7): H01L21/3065; B01J19/08; H05H1/00
Domestic Patent References:
| JP11162820A | ||||
| JP2001110791A |
Foreign References:
| WO2001018845A1 |
Attorney, Agent or Firm:
Ichiro Suzuki
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