Title:
プラスチックエンボスキャリアテープ装置
Document Type and Number:
Japanese Patent JP4633714
Kind Code:
B2
Abstract:
An embossed carrier tape manufacturing apparatus includes features for integrating with other processing equipment so that other processes such as forming, filling, and sealing the tape can be performed sequentially in one integrated process. The apparatus includes retractable contact spot heaters for heating the tape prior to embossing, along with a unique heat shield arrangement that is interposable between the heaters and the tape so that the process may be paused. Also, a synchronizing apparatus is integrated so that the carrier tape embossing process may be automatically paused for adjusting to the input rate of other carrier tape processing apparatus.
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Inventors:
Gregerson, Barry El.
Spitzer, James E.
Spitzer, James E.
Application Number:
JP2006509615A
Publication Date:
February 16, 2011
Filing Date:
April 01, 2004
Export Citation:
Assignee:
ADAPTSYS LIMITED
International Classes:
B29C51/08; B29C51/26; B29C51/46; B29C59/02; B65B9/02; B65B9/04; B65B15/04; B65B47/00; B29C35/02; B29C51/10; B29C51/14; B29C51/42; B29L7/00; B65D
Domestic Patent References:
JP2000062023A | ||||
JP2121827A | ||||
JP2000094505A | ||||
JP8281791A | ||||
JP62152719A | ||||
JP2001030347A | ||||
JP2002172592A | ||||
JP11227870A | ||||
JP10272685A | ||||
JP61254455A |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Atsushi Honda
Miho Ikegami
Makoto Onda
Atsushi Honda
Miho Ikegami