Title:
プラスチックエンボスキャリアテープ装置および方法
Document Type and Number:
Japanese Patent JP5001415
Kind Code:
B2
Abstract:
An embossed carrier tape manufacturing apparatus includes features for integrating with other processing equipment so that other processes such as forming, filling, and sealing the tape can be performed sequentially in one integrated process. The apparatus includes retractable contact spot heaters for heating the tape prior to embossing, along with a unique heat shield arrangement that is interposable between the heaters and the tape so that the process may be paused. Also, a synchronizing apparatus is integrated so that the carrier tape embossing process may be automatically paused for adjusting to the input rate of other carrier tape processing apparatus.
Inventors:
Gregerson, Barry El.
Spitzer, James E.
Spitzer, James E.
Application Number:
JP2010222220A
Publication Date:
August 15, 2012
Filing Date:
September 30, 2010
Export Citation:
Assignee:
ADAPTSYS LIMITED
International Classes:
B29C51/26; B29C51/08; B29C51/10; B29C51/38; B29C51/42; B29C59/02; B65B9/02; B65B9/04; B65B15/04; B65B47/00; B29C35/02; B29C51/14; B65D
Domestic Patent References:
| JP2000062023A | ||||
| JP2001030347A | ||||
| JP2121827A | ||||
| JP2000094505A | ||||
| JP8281791A | ||||
| JP62152719A | ||||
| JP2002172592A | ||||
| JP11227870A | ||||
| JP10272685A | ||||
| JP61254455A |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Atsushi Honda
Makoto Onda
Atsushi Honda