Title:
PLASTIC MOLDING HAVING PATTERNED METAL LAYER
Document Type and Number:
Japanese Patent JP3189428
Kind Code:
B2
Abstract:
PURPOSE: To provide a plastic molding having a patterned metal layer of stable quality by providing a spool runner portion with monitor portions on which to form monitor metal layers.
CONSTITUTION: A molding body 10 comprising a spool runner portion 1, monitor portions 2 provided to the portion 1, and plastic moldings 3 provided to the runner portion 1 via gates 4. First, primary molding is carried out using a polyether sulfone to which the catalyst required for electroless plating is added to form the patterned portion 3a of the patterned metal layer of each molding 3 and the surface 2a of each monitor portion 2 into projecting parts. Next, secondary molding is carried out using a polyphenylene sulfide resin to fabricate the molding body 10. Then, portions 3a, 2a are immersed in an electroless plating fluid and the portion 2a is separated sometime during plating to measure the film thickness of the plating using a film thickness gauge and the time required for achieving desired thickness is measured. After plating is finished, the molding body 10 is taken out and after the thickness of the body is made sure at the remaining portion 2 the gates 4 are separated to obtain a finished product.
Inventors:
Toshiyuki Ohaku
Rikio Komakine
Yoshiyuki Ando
Hideki Asano
Rikio Komakine
Yoshiyuki Ando
Hideki Asano
Application Number:
JP29014792A
Publication Date:
July 16, 2001
Filing Date:
October 28, 1992
Export Citation:
Assignee:
Hitachi Cable Ltd.
International Classes:
B29C45/00; B29D99/00; C23C18/31; G12B17/02; H05K3/00; H05K3/18; H05K9/00; B29L31/34; (IPC1-7): G12B17/02; B29D31/00; C23C18/31; H05K3/00; H05K3/18
Domestic Patent References:
| JP58104167A | ||||
| JP6240735A |
Attorney, Agent or Firm:
Nobuo Kinutani