Title:
PLATE FOR LAMINATED PLATE MOLDING AND LAMINATED PLATE
Document Type and Number:
Japanese Patent JP3299501
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To manufacture a plate for a laminated plate molding for carrying out the heat and pressure molding for a metal-clad laminated plate by connecting a power source, by applying power to the metal foil to heat the metal foil, making the dimensional behavior of the laminated plate thus manufactured equal to that of the laminated plate manufactured by the conventional not press molding to enable a use to use the laminated plate thus formed similar to the laminated plate manufactured by the conventional hot press molding and improving the molding properties of the laminate to be manufactured.
SOLUTION: Insulated layers 3 are formed integrally on both faces of a metal plate 2 having the 0.3-2.0 mm thickness and 9-18 ppm coefficient of thermal expansion. The surface roguness of the insulating layer 3 is formed as 5 μm or less. The thermal expansion coefficient of the whole is set at 9-18 ppm. A laminated plate having the dimensional behavior equal to that of the laminate manufactured by the hot press mold available heretofore can be manufactured by using a laminate molding plate thus formed.
Inventors:
Tsutomu Ichiki
Hideto Misawa
Hiroyuki Mori
Owa Aoi
Hideto Misawa
Hiroyuki Mori
Owa Aoi
Application Number:
JP7937898A
Publication Date:
July 08, 2002
Filing Date:
March 26, 1998
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
B32B15/20; B29C43/20; B29C43/32; B32B15/08; B29L9/00; (IPC1-7): B32B15/20; B29C43/20; B29C43/32; B32B15/08
Domestic Patent References:
| JP11268062A | ||||
| JP9254310A | ||||
| JP5331675A | ||||
| JP8506289A |
Attorney, Agent or Firm:
Keisei Nishikawa (1 person outside)