Title:
板状物の加工方法
Document Type and Number:
Japanese Patent JP7285637
Kind Code:
B2
Abstract:
To allow for grasping of the dope amount of a wafer without processing.SOLUTION: A dope amount detection method includes a placement step ST1 for placing a plate on a chuck table, a detection laser beam irradiation step ST3 of irradiating a laser beam with an output not exceeding the processing threshold value of the plate by positioning a focus point on the surface side of the plate, an imaging step ST4 of capturing the laser beam reflected on the surface side of the plate, and a dope amount determination step ST5 of determining the dope amount of impurities contained in the plate on the basis of the intensity of reflection light captured in imaging step ST4. Furthermore, a processing method of the plate includes a processing condition selection step ST8 for selecting the processing conditions corresponding to the dope amount determined in the dope amount determination step ST5, and a processing step ST9 of carrying out processing by irradiating the plate with a laser beam under the processing conditions selected in the processing condition selection step ST8.SELECTED DRAWING: Figure 6
Inventors:
Kunimitsu Takahashi
Naoki Murasawa
Naoki Murasawa
Application Number:
JP2018229436A
Publication Date:
June 02, 2023
Filing Date:
December 06, 2018
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B23K26/00; G01N9/00; G01N29/11; G01N29/24
Domestic Patent References:
| JP2003148911A | ||||
| JP2002005828A | ||||
| JP3119745A | ||||
| JP2009212341A | ||||
| JP7063667A | ||||
| JP2013258253A | ||||
| JP2002192370A |
Foreign References:
| US20060166385 | ||||
| US5007741 |
Attorney, Agent or Firm:
Sakai International Patent Office