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Title:
PLATED INJECTION-MOLDED ARTICLE
Document Type and Number:
Japanese Patent JPH07205211
Kind Code:
A
Abstract:

PURPOSE: To obtain a molded article having a crystalline layer immediately close to the surface of the molded article and improve the fast sticking strength of plating by using a mold whose wall faces forming a mold cavity of a main mold are covered in a given thickness with a heat-insulating layer having a predetermined coefficient of thermal conductivity or below, performing injection molding under the condition that a temperature of the main mold is a specific temperature or lower, and then effecting plating.

CONSTITUTION: In an injection-molded article made of a crystalline thermoplastic resin such as a homopolymer, a copolymer, a nylon 6, etc. of POM, a mold is used, wherein a mold wall surfaces forming a mold cavity of a main mold comprising metal are covered in a thickness of 0.05 to 2mm with a heat- insulating layer comprising a heat resistant polyer whose thermal conductivity is 0.002cal/cm.sec.°C below. As the heat resistant polymer, polyimide, polysulfone, polyether sulfone, etc., of various kinds are used. Injection molding is performed under the condition that a temperature of the main mold does not exceed a temperature which is 30°C lower than a deflection temperature under a load of resin to be molded, and plating is then effected.


Inventors:
OKUNO OSAMU
KATAOKA HIROSHI
Application Number:
JP720294A
Publication Date:
August 08, 1995
Filing Date:
January 26, 1994
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
B32B15/08; B29C33/38; B29C45/37; B29L9/00; (IPC1-7): B29C45/37; B29C33/38; B32B15/08