To provide a plated terminal for a connector having a tin plating layer on the outermost surface and further a nickel substrate layer, and of which increase of contact resistance on the outermost surface by growth of tabular tin-nickel alloy is suppressed, and to provide a method of manufacturing the same.
A nickel plating layer formed on a surface of a mother material of region which includes a contact part electrically contacting with other conductive members, and a tin plating layer formed on the outermost surface by contacting with the surface of the nickel plating layer are applied to a reflow treatment at a temperature more than a melting point of tin to form a nickel-tin alloy in an interface between the nickel plating layer and the tin plating layer.
| WO/2021/193781 | PCB TERMINAL, CONNECTOR, WIRE HARNESS WITH CONNECTOR, AND BOARD UNIT |
| JPH03162589 | COLORING METHOD |
| JPS5633494 | PLATING METHOD |
MUNAKATA TERUYOSHI
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
| JP2006219736A | 2006-08-24 | |||
| JP2006206977A | 2006-08-10 |