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Title:
PLATED TERMINAL FOR CONNECTOR AND METHOD OF MANUFACTURING PLATED TERMINAL FOR CONNECTOR
Document Type and Number:
Japanese Patent JP2014040649
Kind Code:
A
Abstract:

To provide a plated terminal for a connector having a tin plating layer on the outermost surface and further a nickel substrate layer, and of which increase of contact resistance on the outermost surface by growth of tabular tin-nickel alloy is suppressed, and to provide a method of manufacturing the same.

A nickel plating layer formed on a surface of a mother material of region which includes a contact part electrically contacting with other conductive members, and a tin plating layer formed on the outermost surface by contacting with the surface of the nickel plating layer are applied to a reflow treatment at a temperature more than a melting point of tin to form a nickel-tin alloy in an interface between the nickel plating layer and the tin plating layer.


Inventors:
FURUKAWA KINGO
MUNAKATA TERUYOSHI
Application Number:
JP2012184695A
Publication Date:
March 06, 2014
Filing Date:
August 24, 2012
Export Citation:
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Assignee:
AUTO NETWORK GIJUTSU KENKYUSHO
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
C25D7/00; C25D5/12; C25D5/50; H01R13/03
Domestic Patent References:
JP2006219736A2006-08-24
JP2006206977A2006-08-10
Attorney, Agent or Firm:
Noboru Ueno