Title:
PLATING APPARATUS AND PLATING METHOD
Document Type and Number:
Japanese Patent JP3282585
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a plating apparatus which allows the omission of the replenishment of a plating liquid and the work for regulation of a liquid level, substantially prevents the occurrence of a fluctuation in the effective area of an anode and is capable of surely and efficiently forming plating films of consistent quality on many works.
SOLUTION: This plating apparatus is constituted by erecting the bar-shaped anode 4 on the inside base surface 2a of a plating bath 2 in which the plating liquid 3 is stored. An annular basket 5 is pivotally supported at the anode 4 in such a manner that the basket may be rotated around the anode 4. A cathode ring 7 is stuck to the inside surface of the outer peripheral wall 5c of the basket 5. The basket 5 and the anode 4 are submerged in the plating liquid 3. Chip type electronic part elements 11 as the works are moved to the outer peripheral wall 5c side by rotationally driving the basket 5 around the anode 4, by which these elements are brought into contact with the cathode ring 7 and the plating films are formed thereon.
Inventors:
Kazuma Tanaka
Takao Hosokawa
Takao Hosokawa
Application Number:
JP15324198A
Publication Date:
May 13, 2002
Filing Date:
June 02, 1998
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
C25D7/00; C25D17/22; H01G4/30; (IPC1-7): C25D17/22; C25D7/00; H01G4/30
Domestic Patent References:
| JP8239799A |
Attorney, Agent or Firm:
Miya Saki Main tax (1 person outside)