PLATING BATH AND METHOD FOR DEPOSITING METAL LAYER ON SUBSTRATE

Japanese Patent JP2009149995

A

To provide a plating bath and a method for depositing a uniform and high-gloss metal layer having excellent physical-mechanical properties, on a substrate.

The metal plating bath includes hetero-atom containing organic compounds that can prevent the degradation of a plating-bath additive and have the following formula: R1-X-R2, (wherein X is -S(O)n-S(O)p-S(O)q-S(O)u-S(O)v-S(O)w-, -(S(O)z)m-(CH2)y-(S(O)z')m'-, or -SO2-S-(CH2)y-S-SO2-, wherein n, p, q, u, v, w, z and z' are each independently an integer of from 0 to 2, m and m' are independently an integer of from 1 to 6, and y is an integer of from 2 to 4, or X is a hetero atom selected from S, O, and N, or N substituted with (C1-C6) alkyl or a tosyl group, and R1 and R2 may be taken together along with the atoms, to which they are attached, to form a 5 to 18 membered heterocyclic ring).

COBLEY ANDREW J
KAPECKAS MARK J
REDDINGTON ERIK
SONNENBERG WADE
BARSTAD LEON R
BUCKLEY THOMAS

JP2009050353A

July 09, 2009

March 04, 2009

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ROHM & HAAS ELECT MAT

C25D3/38; C25D3/02; C25D3/10; C25D3/12; C25D3/22; C25D3/26; C25D3/32; C25D3/36; C25D3/46; C25D3/48; C25D3/50; C25D3/52; C25D3/54; C25D7/00; H05K3/24

JPH01100292A	1989-04-18
JPH11269691A	1999-10-05
JP2001164396A	2001-06-19
JP2001073182A	2001-03-21
JP2000510289A	2000-08-08
JP2001110832A	2001-04-20
JP2000226686A	2000-08-15
JPH11513078A	1999-11-09
JPH0841676A	1996-02-13

WO2000044042A1	2000-07-27
WO2000079031A1	2000-12-28
WO2000000672A2	2000-01-06

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