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Title:
めっき付着量制御装置および制御方法
Document Type and Number:
Japanese Patent JP7168444
Kind Code:
B2
Abstract:
To perform a control by reflecting various guarantee standards determined for every steel plate, prevent adhesion of excessive plating, improve a yield and secure a quality of a raw material by performing a control such that plating adhesion amount lower limit shortage does not occur in a range that the standard is satisfied.SOLUTION: A plating adhesion amount control device 100 calculates a lower limit cracking risk of a plating adhesion amount corresponding to a guarantee standard of a steel plate by a preset control performed prior to processing the steel plate, and a feedback control performed during the steel plate processing. In the preset control, a plating adhesion amount target value is corrected using a value corresponding to a risk. In the feedback control, a control is performed so that the plating adhesion amount becomes lower than the lower limit by correcting an adhesion amount deviation. A risk that the plating adhesion amount becomes lower than the lower limit is calculated for every guarantee standard. Therefore, plating is not excessively adhered due to unnecessary correction, so that a plating raw material can be saved.SELECTED DRAWING: Figure 17

Inventors:
Masahiro Kayama
Shigehisa Kurihara
Naonori Iwahiro
Morishita Hisao
Kazuhiko Soga
Hirohiro Hirano
Application Number:
JP2018248026A
Publication Date:
November 09, 2022
Filing Date:
December 28, 2018
Export Citation:
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Assignee:
株式会社日立製作所
International Classes:
C23C2/20; C23C2/00; C23C2/40
Domestic Patent References:
JP2017172005A
JP2008050680A
JP2009275266A
JP2008031509A
JP7316766A
JP6017218A
JP10265929A
JP6033212A
JP7180020A
JP6346213A
JP3031463A
Foreign References:
CN108396275A
Attorney, Agent or Firm:
Patent Attorney Corporation Isono International Patent and Trademark Office