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Title:
PLATING DEVICE AND CURRENT VALUE DECIDING METHOD
Document Type and Number:
Japanese Patent JPH07102400
Kind Code:
A
Abstract:

PURPOSE: To provide a plating device in which the thickness and dispersion of plating can be controlled and uniformized even in the case the shape and area of the object to be plated in accordance with divided anodes are different and to provide a method for deciding current value.

CONSTITUTION: An anode by which the object 4 to be plated is applied with plating in a plating tank 3 is divided, they are partitioned by bulkheads 5 to form into divided anodes 6 respectively, the surface of the object 4 to be plated is subdivided into small sections in accordance with the divided anodes 6, the area to be plated in practice is found per small section, the relationship between the size of the area to be plated and the current value is represented by a fuzzy rule in accordance with a rule of thumb, and the membership function of the position of each small section to the area to be plated and the membership function of the plating current value per small section are found. By practicing fazzy inference in accordance with fazzy knowredge contg. the same all membership functions, the plating current value for applying electric current to the divided anode per small section is decided, and a current value setting command 8 is given to plural current sources 1 in a power source part 2 from a control part 9.


Inventors:
HIRAYAMA YASUHIRO
Application Number:
JP24963493A
Publication Date:
April 18, 1995
Filing Date:
October 06, 1993
Export Citation:
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Assignee:
NEC CORP
International Classes:
C25D21/00; C25D21/12; H05K3/24; (IPC1-7): C25D21/12; C25D21/00
Domestic Patent References:
JPH03243797A1991-10-30
JP2149767B
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)