Title:
メッキ液補充装置
Document Type and Number:
Japanese Patent JP6901061
Kind Code:
B2
Abstract:
To provide a plating solution replenishment apparatus that can efficiently dissolve copper oxide into plating solution without installing a special dissolution tank for space savings.SOLUTION: A plating solution replenishment apparatus 1 of the present invention comprises a circulation line 2 in which plating solution is sucked up from a plating tank A for copper plating, added with copper oxide, and returned to the plating tank A. The plating solution replenishment apparatus 1 also comprises at least: pumping means 3 and 4, which are placed on the circulation line 2, for sucking up the plating solution from the plating tank A and for circulating the plating solution on the circulation line 2; an ejector 5, which is placed on the circulation line 2, for directly mixing the plating solution with copper oxide powder; and an in-line mixer 9 for accelerating the dissolution of copper oxide powder into the plating solution, being arranged on the downstream side of the ejector 5.SELECTED DRAWING: Figure 1
Inventors:
Kawasaki Michio
Application Number:
JP2017160979A
Publication Date:
July 14, 2021
Filing Date:
August 24, 2017
Export Citation:
Assignee:
Area Design Co., Ltd.
International Classes:
C25D21/14; B01F1/00; B01F3/12; B01F5/04; B01F5/06; C25D17/00
Domestic Patent References:
| JP2003502495A | ||||
| JP2009242940A | ||||
| JP6025863A |
Attorney, Agent or Firm:
Kazuho Onuki