Title:
PLATING MATERIAL
Document Type and Number:
Japanese Patent JP3297861
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a plating material having high preventing force to corrosive environment, achieving the stabilization of contact resistance, developing abrasion resistance for providing lubricity to the fitting of a connector many times, reducing the friction resistance in the fitting of the connector in order to provide lubricity and capable of reducing force at times of insertion and pulling-out.
SOLUTION: In a plating material equipped with the plating layer 3 formed on a substrate 1 or on the substrate layer 2 formed on the substrate 1, the org. substance bonding layer 4 formed on the plating layer 3 and a lubricating layer 5 formed on the org. substance bonding layer 4 are provided and the org. substance bonding layer 4 comprises an org. compd. capable of being chemically bonded to the component of the plating layer 3 and the lubricating layer 5 is substantially composed of a film of a polymeric aggregate having flowability.
Inventors:
Yuji Shintani
Application Number:
JP18286598A
Publication Date:
July 02, 2002
Filing Date:
June 29, 1998
Export Citation:
Assignee:
Japan Aviation Electronics Industry Co., Ltd.
International Classes:
B32B15/08; B32B15/01; B32B15/04; C22C5/02; C25D3/48; C25D3/62; C25D5/12; C25D5/48; C25D7/00; H01R13/03; (IPC1-7): B32B15/08; C25D5/48; C25D7/00; H01R13/03
Domestic Patent References:
| JP2116024A | ||||
| JP931663A | ||||
| JP3215697A |
Attorney, Agent or Firm:
Yosuke Goto (1 person outside)
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