Title:
PLATING METHOD FOR FORMING CASE FOR ELECTROMAGNETIC SHIELD
Document Type and Number:
Japanese Patent JPS5763694
Kind Code:
A
Abstract:
PURPOSE:To form a titled case formed with a metallic plating of prescribed thick- ness on recessed side by subjecting a synthetic resin formed product provided with air mask grooves and an air vent hole to chemical plating then to electroplating. CONSTITUTION:Air mask grooves 3 are provided at the end face of the circumferential walls in the lower opening part 1a of a formed case 1 made of a synthetic resin and a through-hole 2 for air venting is formed in the central part of a top wall 1b. An air mask groove 4 is provided around this hole. Next, the case 1 with the top wall 1b faced upward is immersed in a chemical plating bath by a one-rack system, and is plated (hence, the formed chemical plating layer 5 is cut off between the outer and inner side of the case 1 by the grooves 3, 4, and there is no electrical conduction between both). Thence, the case 1 held put in the above-mentioned rack is immersed in an electrolytic bath, and its lower opening part 1a is opposited to an electrode, whereby a metallic plating layer 6 of desired thickness is formed on the inner side of the case 1.
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Inventors:
KANEKO MICHIO
Application Number:
JP13671280A
Publication Date:
April 17, 1982
Filing Date:
October 02, 1980
Export Citation:
Assignee:
SANKO LITE IND
International Classes:
C23C18/16; C23C18/31; C23C28/00; C25D5/02; C25D5/56; C25D7/00; (IPC1-7): C23C3/02; C25D5/02; C25D7/00