Title:
めっき方法、めっき装置、及び限界電流密度を推定する方法
Document Type and Number:
Japanese Patent JP6971915
Kind Code:
B2
Abstract:
A plating method for plating a substrate by increasing a current value from a predetermined current value to a first current value is provided. The plating method plates the substrate for a first predetermined period with the first current value when a first current density corresponding to the first current value is lower than a limiting current density. This plating method includes measuring a voltage value applied to the substrate, and when the current value is increased from the predetermined current value to the first current value, determining whether the first current density is equal to or more than the limiting current density or not based on an amount of change in the voltage value.
Inventors:
Yasuyuki Masuda
Tadashi Shimoyama
Tadashi Shimoyama
Application Number:
JP2018107541A
Publication Date:
November 24, 2021
Filing Date:
June 05, 2018
Export Citation:
Assignee:
Ebara Corporation
International Classes:
C25D21/12
Domestic Patent References:
| JP2013095968A | ||||
| JP2016027196A | ||||
| JP2015134963A |
Attorney, Agent or Firm:
Toru Miyamae
Shinjiro Ono
Yukio Kanegae
Makoto Watanabe
Shinjiro Ono
Yukio Kanegae
Makoto Watanabe