Title:
PLATING METHOD OF PRINTED CIRCUIT BOARD, PACKAGING STRUCTURE BODY, LIQUID CRYSTAL DEVICE, AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DEVICE
Document Type and Number:
Japanese Patent JP2002026491
Kind Code:
A
Abstract:
To provide the plating method of printed circuit board that can cope with the fin conductive pattern of the printed circuit board and at the same time can easily control plating thickness.
In the plating method of a printed circuit board for performing electroless plating onto the conductive pattern 102 of a printed circuit board 100, electroless plating liquid is supplied onto the conductive pattern 102 by the ink jet system.
Inventors:
IMAEDA CHIAKI
Application Number:
JP2000205226A
Publication Date:
January 25, 2002
Filing Date:
July 06, 2000
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
G02F1/1345; C23C18/31; C25D5/02; C25D7/00; H05K1/14; H05K3/10; H05K3/18; H05K3/24; H05K3/36; (IPC1-7): H05K3/18; C23C18/31; C25D5/02; C25D7/00; G02F1/1345; H05K1/14; H05K3/10; H05K3/24; H05K3/36
Attorney, Agent or Firm:
Masanori Ueyanagi (1 outside)
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