Title:
PLATING METHOD
Document Type and Number:
Japanese Patent JP2015089955
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To securely and easily form a plating layer having high adhesive properties on the surface of a probe pin formed by tungsten or a tungsten alloy.SOLUTION: Provided is a plating method comprising: a removing process (anode electrolysis process: step S04) of applying anode electrolysis treatment to a probe pin 10 to remove a passive film from the surface of the probe pin 10; and a layer forming process (gold strike plating process: step S05) of forming a gold strike plating layer 21 on the surface of the probe pin 10 by electroplating. The removing process and the layer forming process are performed in a state where the probe pin 10 is dipped into a plating bath 50 in both of them. The transfer from the removing process to the layer forming process is performed by changing the applied voltage to the probe pin 10 without discharging the probe pin 10 from the plating bath 50.
Inventors:
ISHIHARA KIMINORI
NINOMIYA YASUO
MATSUMOTO RYOTA
NINOMIYA YASUO
MATSUMOTO RYOTA
Application Number:
JP2013230428A
Publication Date:
May 11, 2015
Filing Date:
November 06, 2013
Export Citation:
Assignee:
NIPPON ALEPH
International Classes:
C25D5/34; G01R1/067; G01R1/073
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toru Kamada
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toru Kamada
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