PURPOSE: To provide the titled compsn. for electroless metal plating, which has good printability and excellent resistance to chemicals and heat and adhesion to cured film, consisting of a specified epoxy resin compsn.
CONSTITUTION: 100pts.wt. epoxy resin (A) such as Epikote 152 (a product of Shell International Chemicals Corp.) a hardener (B) for the epoxy resin (such as an arom. amine hardener in an amount of 0.5W1.5 equivalents per epoxy equivalent of epoxy resin and 5W30pts.wt. imidazole hardener), 1W35pts.wt. compd. (C) capable of reacting with the epoxy resin and improving water-resistant adhesion to copper foil, such as 2-mercaptothiazoline, a filler (D) such as fine talc powder, a thixotropic agent (E) such as fine SiO2 powder and an org. solvent (F) such as n-butyl cellosolve are mixed together. Pref. the resultant compsn. has a thixotropy index of 5W40 and a viscosity (a Brookfield viscometer, 1r.p.m. at 20°C) of 800W1,000p.
OKA HITOSHI
MATSUO AKIRA
KIKUCHI HIROSHI
