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Patent Searching and Data


Title:
PLYWOOD ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPH10168421
Kind Code:
A
Abstract:

To obtain a plywood adhesive compsn. which reduces the amt. of formalin released from plywood and has an improved water resistance and improved stability and workability in plywood production by incorporating an amino resin or a phenol resin and a polyacrylamide resin having specific functional groups into the same.

One mol of an acrylic monomer [e.g. (meth)acrylamide or dimethylaminoethyl methacrylate] and 0.01-0.50mol of a functional monomer [e.g. (meth)acrylic acid or (meth)acrylamide] are copolymerized in the presence of a free-radical polymn, initiator at 0-40°C in an aq. medium to give a polyacrylamide resin having functional groups capable of forming cross-links with an amino resin or a phenol resin. 1-900 pts.wt. thus obtd. polyacrylamide resin is compounded with 100 pts.wt. amino resin or phenol resin and 50-400wt.% wheat flour and water to give a plywood adhesive compsn. having a viscosity of 10-100P.


Inventors:
OKADA KATSUYOSHI
DOI KIYOTO
UEDA KYOICHI
TANAKA KOICHI
Application Number:
JP32998396A
Publication Date:
June 23, 1998
Filing Date:
December 10, 1996
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C09J161/00; (IPC1-7): C09J161/00