Title:
金属CMPのための研磨組成物
Document Type and Number:
Japanese Patent JP4510374
Kind Code:
B2
Abstract:
Chemical mechanical polishing compositions and slurries comprising a film-forming agent and at least one silane compound wherein the compositions are useful for polishing substrate features such as copper, tantalum, and tantalum nitride features.
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Inventors:
One, Shumin
Granvine, Stephen K.
Strains, Christopher Sea.
Hogland, Eric W. G.
Granvine, Stephen K.
Strains, Christopher Sea.
Hogland, Eric W. G.
Application Number:
JP2002507952A
Publication Date:
July 21, 2010
Filing Date:
June 14, 2001
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORPORATION
International Classes:
B24B37/00; C09K3/14; C09G1/02; C09K13/04; C09K15/20; C23F3/00; H01L21/304; H01L21/306; H01L21/321
Domestic Patent References:
| JP11116948A | ||||
| JP8216023A | ||||
| JP8083780A | ||||
| JP2000133621A | ||||
| JP11021546A | ||||
| JP10116804A | ||||
| JP2002528903A | ||||
| JP10180619A | ||||
| JP10237426A | ||||
| JP2000114211A | ||||
| JP7142830A | ||||
| JP2000143807A |
Attorney, Agent or Firm:
Takashi Ishida
Jun Tsuruta
Nobuo Sekine
Masaya Nishiyama
Higuchi Souji
Jun Tsuruta
Nobuo Sekine
Masaya Nishiyama
Higuchi Souji