POLISHING DEVICE AND POLISHING METHOD OF PLATE-LIKE OBJECT

Title:

POLISHING DEVICE AND POLISHING METHOD OF PLATE-LIKE OBJECT

Document Type and Number:

Japanese Patent JP2015199134

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method capable of preventing polishing failure due to concentration fluctuation of slurry.SOLUTION: A polishing device for polishing a plate-like object includes retention means which retains the plate-like object, polishing means which has a polishing pad for polishing the plate-like object retained by the retention means and slurry supply means for supplying slurry to the plate-like object retained by the retention means. The slurry supply means has: a mixing part for mixing a mixed liquid supplied from a mixed liquid supply source in which a plurality of chemical solutions are mixed via first flow rate regulation means and water supplied from a water supply source via second flow rate regulation means and diluting the mixed liquid into a predetermined concentration to prepare the slurry; a slurry supply path for supplying the slurry to the plate-like object; and electric conductivity detection means which is arranged on the slurry supply path and detects electric conductivity of the slurry, and the first flow rate regulation means or the second flow rate regulation means is controlled such that the electric conductivity detected by the electric conductivity detection means gets to a prescribed value.

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Inventors:

AKABANE ATSUNORI

Application Number:

JP2014077559A

Publication Date:

November 12, 2015

Filing Date:

April 04, 2014

Export Citation:

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Assignee:

DISCO ABRASIVE SYSTEMS LTD

International Classes:

B24B37/00; B24B57/02; H01L21/304

Domestic Patent References:

JP2002016030A	2002-01-18
JP2003188123A	2003-07-04
JPH10315135A	1998-12-02
JPH10242090A	1998-09-11
JP2000308957A	2000-11-07
JP2003197575A	2003-07-11

Foreign References:

WO2002053273A2

2002-07-11

Attorney, Agent or Firm:

Akira Matsumoto
Tomohiro Okamoto

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