To provide a polishing device which automates adjusting work of a lowered location of a member forming a top ring, and shortens the time required for the adjusting work, and to provide a polishing method.
The polishing device is formed of a stopper 32, a bracket 28, a sensor 36, and an elevating unit 34. The bracket 28 ascends/descends together with the top ring 20 and is engageable with the stopper 32. The sensor 36 detects a distance between the stopper 32 and the bracket 28. The elevating unit 34 adjusts the location of the stopper 32 when a retainer ring 44 is brought into contact with a polishing pad 10 while a lower surface of a housing 40 of the top ring 20 is located at a predetermined height from the polishing pad 10, such that the distance between the stopper 32 and the bracket 28 becomes equal to a difference between the height of the lower surface of the housing 40 at the time of polishing, and the predetermined height.
| JP6734670 | Grinding device |
| JPS584343 | 【考案の名称】往復送り時の緩衝装置を備えた刃物研削盤 |
| JPS59191253 | [Title of the device] A reckless-run prevention device of a whetstone stand |
INOUE MASABUMI
SAKURAI KUNIHIKO
Shintaro Hotta
Ryoji Kosugi
Tomohiro Mori