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Title:
POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2000061830
Kind Code:
A
Abstract:

To provide a polishing device including two polishing means either one of which can be used or both of which can simultaneously used in order to enhance to the throughput.

Two polishing means 7 each having two surface plates are provided in an index table device 3 for distributing wafers from a supply part 2, and a dresser mechanism 8 and a swivel and swing mechanism 9 having a pressure plate 16 is provided to each of the surface plates 10, each being common for each two surface plates. Only either one of the surface plate can be operated or both surface plates can be operated.


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Inventors:
HAKOMORI SHUNJI
SHIMIZU TOSHIKUNI
HATANO KAZUTOMO
NEZU MOTOI
SEKOGUCHI YASUSHI
UEDA TAKAHIRO
SUZUKI MASATOMO
Application Number:
JP23299498A
Publication Date:
February 29, 2000
Filing Date:
August 19, 1998
Export Citation:
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Assignee:
SPEEDFAM IPEC CO LTD
International Classes:
B24B37/04; B24B53/017; H01L21/304; (IPC1-7): B24B37/04; B24B37/00; H01L21/304
Attorney, Agent or Firm:
Mikio Nakabayashi



 
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