Title:
POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2023165509
Kind Code:
A
Abstract:
To suppress the degradation of detection accuracy of a height position of a polishing member, with a simple structure.SOLUTION: A polishing device includes: a conveyer 10 that carries a workpiece W in a carrying direction P on a horizontal surface; a supporting part 20 that is disposed above the conveyer 10; a rotation member 30 that is supported by the supporting part 20 so as to ascend/descend, and rotates around a first rotation axis AX1 in parallel with a width direction Q of the conveyer 10 orthogonal to the carrying direction P on a horizontal surface or a vertical direction orthogonal to a carrying surface 13a of the workpiece W in the conveyer 10; a polishing member 40 that is detachably attached to the rotation member 30, and rotates around the first rotation axis AX1 integrally with the rotation member 30 to polish a surface of the workpiece W; and a detection device 50 that detects a height of the polishing member 40. The detection device 50 comprises a moving body 51 that contacts with the rotation member when the rotation member descends while the polishing member 40 rotates, and moves by rotations of the polishing member 40, and a movement detecting portion 52 that detects the movement of the moving body 51.SELECTED DRAWING: Figure 1
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Inventors:
NAKAMURA SHOGO
Application Number:
JP2022076606A
Publication Date:
November 16, 2023
Filing Date:
May 06, 2022
Export Citation:
Assignee:
MURATA MACHINERY LTD
International Classes:
B24B47/22; B24B7/06; B24B29/00; B24B49/12
Attorney, Agent or Firm:
Kazuya Nishi
Tomihiko Isono
Tomihiko Isono
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