Title:
研磨装置、及び研磨方法
Document Type and Number:
Japanese Patent JP7098311
Kind Code:
B2
Abstract:
A polishing pad is held using a polishing table. The polishing table is driven to rotate using a first electric motor. The top ring for holding a semiconductor wafer and pressing the top ring against a polishing pad is driven to rotate by a top ring motor. The top ring is held by the swing arm. The swing arm is made to swing around a swing center on the swing arm by a swing shaft motor. A first output is generated by detecting a current value of the swing shaft motor. While polishing the semiconductor wafer by causing the semiconductor wafer to swing around the swing center on the swing arm, a change of a frictional force between the polishing pad and the semiconductor wafer is detected by increasing a change amount of the first output.
Inventors:
Yuta Suzuki
Taro Takahashi
Taro Takahashi
Application Number:
JP2017233315A
Publication Date:
July 11, 2022
Filing Date:
December 05, 2017
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B49/16; B24B37/013; B24B49/10; H01L21/304
Domestic Patent References:
| JP6227821B1 | ||||
| JP2008108940A | ||||
| JP2016215288A |
Foreign References:
| US6293845 |
Attorney, Agent or Firm:
Toru Miyamae
Yukio Kanegae
Koichi Kushida
Makoto Watanabe
Yukio Kanegae
Koichi Kushida
Makoto Watanabe