Title:
POLISHING HEAD OF CHEMICAL-MECHANICAL POLISHING DEVICE
Document Type and Number:
Japanese Patent JP3810647
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing head of a chemical-mechanical polishing device, for evenly polishing both the central part and edge part of a wafer.
SOLUTION: A housing 110 comprises an air through-hole for guiding air stream. A carrier 120 is connected to a housing 110, supporting a wafer polished by the polishing pad. A wafer-chucking device 130 is attached to the carrier 120 for grasping the wafer. A holding member 140 is attached to the edge part of carrier 120 for guiding the wafer-chucking device 130 to protect/maintain the wafer. Since, with the wafer tightly contacting the wafer chucking device 130, a biasing force is applied evenly on a wafer-chucking member 134, independently of a force used for positioning the holding member 140 to the polishing pad, and since pressure acts on the polishing pad, a constant force on the wafer can be applied to the polishing pad.
Inventors:
Park
Application Number:
JP2001119805A
Publication Date:
August 16, 2006
Filing Date:
April 18, 2001
Export Citation:
Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
H01L21/304; B24B37/005; B24B37/30; (IPC1-7): H01L21/304; B24B37/00; B24B37/04
Domestic Patent References:
| JP2001513451A | ||||
| JP64045566A | ||||
| JP5069314A | ||||
| JP10044029A | ||||
| JP9019863A | ||||
| JP11042550A | ||||
| JP8229808A | ||||
| JP11138429A |
Foreign References:
| WO1999007516A1 |
Attorney, Agent or Firm:
Masaki Hattori