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Title:
研磨ヘッド、化学的機械的研磨装置、および、化学的機械的研磨方法
Document Type and Number:
Japanese Patent JP7264039
Kind Code:
B2
Abstract:
A polishing head (40) is provided with a wafer holding member (44) for holding a wafer (W), a support pad (46) provided on the wafer (W) side of the wafer holding member (44), and a temperature measurement mechanism (47) provided between the wafer holding member (44) and the support pad (46) and for measuring the temperature of the support pad (46).

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Inventors:
Yamamoto victory
Application Number:
JP2019229378A
Publication Date:
April 25, 2023
Filing Date:
December 19, 2019
Export Citation:
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Assignee:
Sumco inc.
International Classes:
B24B37/015; B24B37/30; H01L21/304
Domestic Patent References:
JP2005005317A
JP2006332520A
JP61265262A
Attorney, Agent or Firm:
Patent Attorney Corporation Kinoshita Intellectual Property Office



 
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