Title:
研磨液及び研磨方法
Document Type and Number:
Japanese Patent JP7028193
Kind Code:
B2
Abstract:
A polishing liquid for polishing a surface to be polished containing a tungsten material, the polishing liquid comprising abrasive grains; a polymer having a cationic group at the terminal; an oxidizing agent; a metal oxide-dissolving agent; and water, in which the polymer has a structural unit derived from an unsaturated carboxylic acid, a weight average molecular weight of the polymer is 20000 or less, and a pH is less than 5.0.
Inventors:
Hiroshi Ono
Masato Mizutani
Masato Mizutani
Application Number:
JP2018567352A
Publication Date:
March 02, 2022
Filing Date:
January 23, 2018
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| JP2000315667A | ||||
| JP2010518601A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Tomoya Koshita
Yoshinori Shimizu
Hiroyuki Hirano
Tomoya Koshita