POLISHING METHOD AND POLISHING COMPOSITION

Title:

POLISHING METHOD AND POLISHING COMPOSITION

Document Type and Number:

Japanese Patent JP2006205265

Kind Code:

A

Abstract:

To provide a polishing method and a polishing composition, for polishing a silicon wafer in high flatness as double-side mirror surfaces.

A double-side polishing device polishes both surfaces of a polishing object, while supplying the polishing composition composed of silicon oxide particles dispersed in water, by rotating at least one of upper-lower surface plates and the polishing object, while sandwiching and bringing the polishing object into pressure contact between the upper-lower surface plates stuck with polishing cloth. A double-side polishing method performs polishing while supplying an aqueous polishing composition of setting the concentration of the silicon oxide particles to 2 wt.% or less to the whole polishing composition and indicating high electric conductivity and alkalinity, by using hard polishing cloth and a polishing object holding carrier arranged in substantially the same thickness as the thickness being a target of the polishing object.

Inventors:

TANAKA HIROAKI
NAGAYAMA HITOSHI

Application Number:

JP2005016395A

Publication Date:

August 10, 2006

Filing Date:

January 25, 2005

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SPEEDFAM CO LTD

International Classes:

B24B37/00; B24B37/08; B24B37/20; B24B37/27; B24B37/28; H01L21/304

Domestic Patent References:

JPH11302634A	1999-11-02
JP2001358095A	2001-12-26
JP2002254299A	2002-09-10
JP2002178255A	2002-06-25
JP2004154919A	2004-06-03
JP2003297777A	2003-10-17
JP2001093866A	2001-04-06
JP2000158329A	2000-06-13
JP2001138225A	2001-05-22

Attorney, Agent or Firm:

Hiroshi Tanaka
Eishiro Higuchi
Harumi Miyamoto

Previous Patent: SUBSTRATE TRANSFER DEVICE

Next Patent: INDEX ROTARY DEVICE