To easily reduce an error in a shape including a waviness in a working face of a workpiece, without requiring a time and labor.
This method has a first correction-polishing process (step S3) for conducting correction polishing while pressing a polishing tool onto the worked face by the first pressure, and a second correction-polishing process (step S6) for conducting correction polishing while pressing the polishing tool onto the worked face by the second pressure different in its value from that of the first pressure. The waviness not removed sufficiently in the first correction-polishing process (step S3) is removed in the second correction- polishing process (step S6), the error in the shape including the waviness in the working face of the workpiece is easily reduced thereby, and the one polishing tool is enough to be used therein.
Next Patent: METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND POLISHING DEVICE