To start a second step polishing of each polishing object in the state that a top layer film to be polished has an optimum film thickness independently of a variation in initial film thicknesses of the top layer films to be polished of the polishing objects even if there is the variation really.
A film thickness of a film to be polished is measured before carrying out the polishing. Then, a first step polishing for polishing midway the film to be polished and the second step polishing for polishing a remaining film to be polished and a next layer film to be polished under a predetermined polishing condition, are carried out in order. Then, the polishing rate of the top layer film to be polished is calculated on the basis of processing time of the film to be polished and measured film thickness value of the film to be polished in the first step polishing and the second step polishing. Then, for the polishing object which is polished after polishing prescribed number of polishing objects, the film thickness of the film to be polished formed on the polishing object is measured before polishing. Then, the processing time of the first step polishing of polishing objects or the polishing objects which are polished after polishing the prescribed number of polishing objects, is determined on the basis of the measured film thickness value and the polishing rate of the film to be polished.
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Ryoji Kosugi
Tetsuya Hirosawa
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