Title:
POLISHING METHOD AND POLISHING DEVICE
Document Type and Number:
Japanese Patent JP3133300
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve a polishing accuracy so as not to transmit a deflection of a driving plate to an upper surface plate.
SOLUTION: This polishing device is provided with a lower surface plate having a buff 14 and an upper surface plate 13 having the buff 14. Plural carriers formed with plural holding holes for loading a work are disposed on the lower surface plate. Each carrier is engaged with a planetary gear and an internal gear, both sides of the work being polished by rotating the planetary gear and the internal gear. A driving plate 28 is connected to an upper surface plate driving shaft 13a through a connecting mechanism 27. The upper surface plate 13 is supported with respect to the driving plate 28 through a holder 41. A deflection of the driving plate 28 is not transmitted to the upper surface plate 13 because the holder 41 has a roller supported by an extension provided to the driving plate 28.
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Inventors:
Shinichi Okuyama
Application Number:
JP7882499A
Publication Date:
February 05, 2001
Filing Date:
March 24, 1999
Export Citation:
Assignee:
System Seiko Co., Ltd.
International Classes:
B24B7/17; B24B37/04; B24B37/08; B24B45/00; (IPC1-7): B24B7/17; B24B37/04; B24B45/00
Domestic Patent References:
| JP10296596A | ||||
| JP3111170A | ||||
| JP4129666A |
Attorney, Agent or Firm:
Yamato Tsutsui (2 outside)
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