Title:
研磨用組成物を用いた研磨方法
Document Type and Number:
Japanese Patent JP5220428
Kind Code:
B2
Abstract:
The present invention provides a polishing composition that can be suitably used in polishing of polysilicon, and a polishing method using the polishing composition. The polishing composition contains a nitrogen-containing nonionic surfactant and abrasive grains and has a pH of 9 to 12. The content of the nitrogen-containing nonionic surfactant in the polishing composition is preferably 20 to 500 ppm. The abrasive grains contained in the polishing composition are preferably colloidal silica. The average primary particle diameter of the abrasive grains contained in the polishing composition is preferably 10 to 90 nm. The content of the abrasive grains in the polishing composition is preferably 1.0 to 5.0% by mass.
Inventors:
Mikikazu Shimizu
Akatsuka Asahiko
Kazuya Kakuda
Akatsuka Asahiko
Kazuya Kakuda
Application Number:
JP2008023227A
Publication Date:
June 26, 2013
Filing Date:
February 01, 2008
Export Citation:
Assignee:
Fujimi Incorporated Co., Ltd.
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| JP2007194261A | ||||
| JP2008021764A |
Attorney, Agent or Firm:
Hironobu Onda
Makoto Onda
Makoto Onda
Previous Patent: GAS BREAKING EQUIPMENT BY EARTHQUAKE
Next Patent: TIGHTENING DEVICE FOR BLADE OF COATING MACHINE
Next Patent: TIGHTENING DEVICE FOR BLADE OF COATING MACHINE