Title:
POLISHING METHOD FOR WAFER
Document Type and Number:
Japanese Patent JPH05304127
Kind Code:
A
Abstract:
PURPOSE: To provide a polishing method required for fine patterning of semiconductor wafer such as silicon wafer in which flatness of semiconductor wafer is further enhanced while preventing mirror effect.
CONSTITUTION: In the polishing method for wafer, a wafer W is mounted on a turn table 2 and liquid abrasive is supplied onto the turn table 2 and then the turn table 2 is turned without pressing the wafer W forcibly thus floating the wafer W.
Inventors:
ARIMOTO YOSHIHIRO
SUGIMOTO FUMITOSHI
MURAKADO MAKI
KIYOKAWA YOSHIHIRO
SUGIMOTO FUMITOSHI
MURAKADO MAKI
KIYOKAWA YOSHIHIRO
Application Number:
JP11022792A
Publication Date:
November 16, 1993
Filing Date:
April 28, 1992
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
B24B7/22; H01L21/304; H01L21/306; (IPC1-7): H01L21/304; B24B7/22; H01L21/306
Attorney, Agent or Firm:
Keizo Okamoto