Title:
研磨用ナノファイバー集積体およびその製造方法並びに研磨部材およびその製造方法
Document Type and Number:
Japanese Patent JP7080499
Kind Code:
B2
Abstract:
A polishing nanofiber aggregate and a method for producing the same are provided that are capable of suppressing a decrease in polishing efficiency even using fine powder for precision polishing. A polishing nanofiber aggregate 1 is used by adsorbing a slurry prepared by mixing fine powder for precision polishing with a liquid. The polishing nanofiber aggregate 1 has an average fiber diameter d of 400 nm or more and 1000 nm or less and a porosity η of 0.70 or more and 0.95 or less. The polishing nanofiber aggregate 1 is capable of reducing an interfiber distance e1 while securing the porosity η. It is thus possible to suppress incorporation of abrasive particles having a small diameter between the fibers.
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| JP3534677 | CHIP SAW |
| WO/2001/014494 | ABRASIVE GRAINS FOR GRINDSTONES, WITH IMPROVED ANCHORING CAPACITY |
Inventors:
Ikegaya Morihiko
Hiroyoshi Soda
Hiroki Toshiki
Eiichi Aoyama
Wu Wei
Hiroyoshi Soda
Hiroki Toshiki
Eiichi Aoyama
Wu Wei
Application Number:
JP2019556470A
Publication Date:
June 06, 2022
Filing Date:
November 29, 2017
Export Citation:
Assignee:
M-Tex Co., Ltd.
International Classes:
B24D3/00; B24D11/00
Domestic Patent References:
| JP2010069592A | ||||
| JP2008240168A | ||||
| JP2234967A | ||||
| JP2012219391A | ||||
| JP2012046843A |
Foreign References:
| WO2007018165A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Prospec Patent Office
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